VIMF 2026, the Vietnam Industrial & Manufacturing Fair, took place from November 4 to 6 at the Kinh Bac Cultural Center in Bac Ninh, Vietnam. With a focus on smart manufacturing and industrial automation, the exhibition brought together more than 700 exhibitors from 25 countries and territories, showcasing technologies and solutions across precision machining, robotics, smart sensing, and other areas of advanced manufacturing.
Mech-Mind’s Booth at VIMF 2026
At VIMF 2026, Mech-Mind showcased seven live applications that demonstrated how its general-purpose “Eye-Brain-Hand” technologies address demanding tasks in consumer electronics, automotive electronics, and machining. The demonstrations covered flexible circuit assembly, GPU power cable handling, precision machine tending, AI-powered defect inspection, and high-precision measurement.
Mech-Mind also presented new products and technologies designed to address key precision-manufacturing challenges, from handling deformable materials and recognizing fine features to imaging highly reflective metal parts.
Click to relive Mech-Mind’s highlights from VISION 2026.
01 Robotic Handling and Precision Assembly
● High-Precision Assembly of FPC Cables
Flexible printed circuit (FPC) cables are thin, flexible, and prone to deformation. Their compact connectors leave little room for positional error, making precise insertion particularly challenging.
The application features the new Mech-Eye UHP-040-5M-GL 3D camera, which offers an XY resolution as fine as 0.017 mm and Z-axis repeatability of ±1 μm, capturing fine features on both the cable and connector. AI-powered recognition accurately locates the cable end and connector despite variations in cable shape and position. The AI-driven software then calculates the insertion position and angle in real time, guiding the robot through precise alignment and compliant insertion in confined spaces.
With coordinated vision, planning, and robotic execution, the system autonomously completes the full process, from picking and loading the FPC to opening the connector’s locking flap, aligning and inserting the cable, closing the flap, and unloading the finished assembly. The insertion success rate exceeds 99.7%.
● Random Picking and Precision Assembly of GPU Power Cables
GPU power cables are flexible and prone to deformation, and their plugs may arrive in varying positions and orientations. Misalignment can result in incomplete connections, while excessive insertion force can damage components.
Combining high-precision visual recognition with AI-based task understanding and motion planning, the system accurately identifies the positions and orientations of both plugs and sockets, then autonomously plans the picking and insertion motions. This enables stable cable handling and compliant insertion with sub-millimeter accuracy.
This coordinated “Eye-Brain-Hand” approach reduces the need for manual adjustments and repeated alignment, improving assembly efficiency and consistency.
● High-Precision Machine Tending of Highly Reflective Gears
Highly reflective gear surfaces, randomly oriented parts, and oil contamination make accurate part localization and reliable CNC machine loading challenging.
With high-precision 3D vision and AI-based anti-reflection algorithms, the robot accurately identifies each gear's position and orientation. AI-driven motion planning then guides the robot to pick and load parts with sub**-**millimeter positioning accuracy.
The coordinated “Eye-Brain-Hand” system autonomously handles the full sequence of loading, unloading, stacking finished parts, and transferring empty bins, demonstrating high-precision handling and continuous multi-step operation in challenging environments.
02 AI-Powered Inspection and Precision Measurement
● Screw Height Inspection on Laptop Cooling Modules
On-Site Photo
Production Interface
Multiple screws are positioned across laptop cooling modules. Dark surfaces and partial occlusion make accurate height measurement more challenging.
This application features the new Mech-Eye LNX-7080-GL 3D laser profiler, which offers Z-axis repeatability of 0.5 μm and a full-range scan rate of up to 20 kHz. It rapidly captures high-resolution 3D point clouds of screws and other miniature features.
The general-purpose “Eye + Brain” system accurately extracts screw-head features and measures their heights relative to a reference plane, identifying protruding screws and screws that are not fully seated. AI-based scan-path planning and multi-scan point-cloud stitching enable the system to cover spatially separated measurement points and inspect multiple screws, helping improve assembly consistency.
● Solder-Joint Defect Inspection for Smartphone Camera Flash Modules
On-Site Photo
Production Interface
Solder joints as small as 0.7 mm require high-quality imaging to identify subtle defects reliably.
Using extended-depth-of-field and multi-view imaging, the system captures clear solder-joint features at different heights. Combined with deep-learning-based pixel-level segmentation and classification, it accurately detects various defects, including missing solder, insufficient solder, excess solder, open solder joints, and foreign objects.
High-speed image acquisition and parallel model inference support efficient inspection. The system generates and visualizes inspection results in real time, helping manufacturers identify soldering issues promptly and improve quality control for precision electronic components.
● Defect Inspection of USB Type-C Connectors
On-Site Photo
Production Interface
Production Interface
USB Type-C connectors have flat surfaces, curved sides, and port faces, often with highly reflective finishes. Their varied geometries and reflective surfaces make complete inspection and reliable identification of subtle defects challenging.
The system combines multi-station, multi-view inspection with coordinated multi-source lighting to inspect all six sides of each connector: the top and bottom surfaces, left and right curved sides, and front and rear port faces.
Using cascaded AI models and pixel-level defect segmentation in Mech-DLK deep learning software, the system accurately identifies more than ten types of defects, including pressure marks, scratches, contamination, deformation, and plating defects. The system also quantifies and visualizes detected defects, improving inspection completeness and consistency.
● Pin Height and Position Measurement for Automotive Connectors
On-Site Photo
Production Interface
Automotive connector pins are small, densely arranged, and highly reflective, making precise measurement difficult. To address these challenges, the “Eye + Brain” system uses reflection suppression, halo filtering, and intelligent denoising to reduce reflection-related interference and image noise.
By scanning from multiple positions, the system captures key features across different regions and accurately identifies the end faces of individual pins, enabling high-precision measurement of pin-height variation and pin positions.
The application features the Mech-Eye LNX-7030-GL 3D laser profiler, which delivers Z-axis repeatability of 0.2 μm and a full-range scan rate of up to 20 kHz. It rapidly generates high-resolution 3D point clouds of the pin array, providing detailed measurement data for these miniature features. The system can also handle different pin types, models, and materials, supporting a wider range of automotive connector inspection requirements.
03 Building for the Future
From high-precision machine tending and flexible assembly to AI-powered defect inspection and dimensional measurement, Mech-Mind's seven demonstrations at VIMF 2026 highlighted how the “Eye-Brain-Hand” technologies are being applied to demanding precision manufacturing processes.
As manufacturers across Southeast Asia and around the world seek more intelligent production capabilities, Mech-Mind will continue advancing its “Eye-Brain-Hand” technologies and product portfolio, strengthening its local delivery and service capabilities, and working with customers and ecosystem partners to support the deployment of more high-value applications.