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Mech-Eye 3D Laser Profilers

Mech-Eye 3D Laser Profilers

Mech-Eye LNX 3D laser profilers feature 4K+ resolution* and high scan rates (up to 15 kHz*) to deliver highly accurate 3D data of tiny features and defects at a faster speed. These sensors are designed for industrial measurement and inspection applications in electronics, EV battery, and automotive industries.

4K+ Resolution

4,096* data points per profile for high-resolution 3D inspection of targets (dents, seams, edges, etc.)

Ultra-High Scan Rates

Scan rates up to 3.3 kHz* (scan of full FOV) and 15 kHz* (scan of full X measurement range). Advanced optics and algorithms to deliver highly accurate 3D data at a faster speed.

Micron-Level Precision

X resolution down to 9 μm*, Z repeatability down to 0.2 μm, and ± 0.02% of F.S. linearity, allowing for the high-precision inspection and measurement of tiny features and defects.

Single-Shot HDR

The function makes it possible to scan dark (low reflectivity) and reflective (high reflectivity) surfaces in one exposure while creating complete point clouds.

Ease of Use

Extensible interface for image acquisition, including C++/C#/Python API. Compliant with GenICam3.0 and GigE Vision standards.

Multiple Models

A cutting-edge lineup designed for inspection and measurement in various scenarios across industries.

* Applicable to LNX-8000 series

Point Cloud Examples

Sealing pin

Sealing pin

Point cloud obtained by Mech-Eye LNX-8030-GL

Smartphone midplate

Smartphone midplate

Point cloud obtained by Mech-Eye LNX-8080-GL

Tire DOT code

Tire DOT code

Point cloud obtained by Mech-Eye LNX-8300-GL

Connector pins

Connector pins

Point cloud obtained by Mech-Eye LNX-7530-GL

Battery cell lid

Battery cell lid

Point cloud obtained by Mech-Eye LNX-7580-GL

Battery module

Battery module

Point cloud obtained by Mech-Eye LNX-75300-GL

Color rendered by height

Applications

Industries: Consumer electronics, EV battery, semiconductor, home appliances, and the automotive industry

Application scenarios: Inspection and measurement of very fine features (e.g., size, depth, height, and flatness)

Connector pin inspection

Connector pin inspection

Cap welding inspection

Cap welding inspection

Tire DOT code reading

Tire DOT code reading

Smartphone midplate flatness measurement

Smartphone midplate flatness measurement

Dimensional measurement of battery modules

Dimensional measurement of battery modules

Monocrystalline silicon rod diameter inspection

Monocrystalline silicon rod diameter inspection

Key Specs

Model LNX-8030-GL LNX-8080-GL LNX-8300-GL LNX-7515-GL* LNX-7530-GL LNX-7580-GL LNX-75150-GL LNX-75300-GL
Data Points per Profile 4,096 3,200
Scan Rate 3.3–15 kHz 2-10 kHz
Reference Distance (RD) 78 mm 250 mm 325 mm 35 mm 78 mm 250 mm 228 mm 325 mm
Measurement Range Z 30 mm 100 mm 305 mm 6 mm 25 mm 76 mm 135 mm 295 mm
Measurement Range X Near 33 mm 76 mm 230 mm 12 mm 31 mm 72 mm 123 mm 219 mm
RD 35 mm 89 mm 310 mm 13 mm 33 mm 82 mm 150 mm 300 mm
Far 37 mm 96 mm 430 mm 13 mm 35 mm 89 mm 167 mm 422 mm
Resolution X 9 µm 23.5 µm 105 µm 4 µm 11 µm 28 µm 52 µm 132 µm
Repeatability Z 0.2 µm 0.5 µm 2 µm 0.15 µm 0.2 µm 0.5 µm 1.5 µm 2 µm
Linearity Z ±0.02% of F.S.
Weight 1.0 kg 1.2 kg 1.4 kg 1.0 kg 1.0 kg 1.2 kg 1.1 kg 1.4 kg
Dimensions 133 × 61 × 102 mm 182 × 63 × 112 mm 195 × 61 × 109 mm 131 × 58 × 100 mm 133 × 61 × 102 mm 182 × 63 × 112 mm 199 × 57 × 108 mm 195 × 61 × 109 mm
Laser Blue (405 nm, Class 2) Blue (405 nm, Class 2M) Blue (405 nm, Class 2) Blue (405 nm, Class 2M)
Lens Inclination 30° 22° 19° 42° 30° 22° 25° 19°
Input Voltage 24 VDC
Peak Power 48W
Communication Interface Gigabit Ethernet
Encoder Input Single-ended and differential encoders supported
Operating Temperature 0–45°C
Safety and EMC CE/FCC/VCCI/KC/ISED/NRTL
IP Rating IP67
Cooling Passive
Remark

1. For detailed product specifications, please refer to Mech-Mind Documentation.

2. The product specifications are subject to Mech-Mind's official website.

* The LNX-7515-GL will soon enter mass production. We warmly invite you to request a prototype for testing.